About IEDMS 2023

IEDMS 2023 is the 28th International Electron Devices and Materials Symposium sponsored by Electronics Devices and Materials Association and National Sun Yat-sen University.

The conference offers an annual platform for international scientists, engineers, and researchers to present the latest research results, ideas, developments, and applications in electron devices and materials. The conference attracts participants from more than seven countries. IEDMS 2023 will be hosted by National Sun Yat-sen University.

One of the events includes a guided harbor cruise with commentary throughout the entire journey, providing the opportunity to enjoy the beautiful harbor and bay area scenery. The cruise lasts for one hour.

Organizer: College of Semiconductor and Advanced Technology Research
Co-organizer: Department of Electrical Engineering

Important Dates

Submission of contributed papers

July 31, 2023
August 14, 2023 (Final Extension)

Notification of acceptance

Mid September, 2023

Early Bird Registration

September 28, 2023

Conference Date

October 19-20, 2023

Topics

A. Compound semiconductor materials and devices

Material growth, high-speed devices, lasers, light-emitting diodes, photodetectors and organic electronics, power devices, associated characterization, modeling, simulation and reliability.

B. Si-based processing, devices and integration

Novel processes and devices (Si, SiGe, Ge), low power ICs, high-voltage devices, optoelectronic ICs, memories, 3D ICs and integration, associated characterization, modeling, simulation and reliability.

C. Novel materials, large-area electronics, and related applications

Material preparation, thin-film transistors, 2D semiconductor devices, thermoelectric devices, associated characterization, modeling, simulation and reliability.

D. Photonic materials/devices, novel device concepts and applications

Novel nanostructures, energy-conversion devices, solar cells, spintronics, MEMS, sensor materials and devices, associated characterization, modeling, simulation and reliability.

Corporate Sponsors